Natural convection cooling of a 6-layer board with internal copper layers, vias (both electrical and thermal) and electrical components.
The impact of coupling the thermal and electrical solutions for a given circuit board is demonstrated to be important for the
accurate prediction of temperature profiles.
Ambient Temperature at 70°C
3 “Load Layers”
3 “Return” Layers
0.00125 sq. in
Analysis Type: Coupled Electrical / Thermal Applications: Design of Bus Bars, Connectors ...
A three-dimensional EFlo model was developed to predict the temperature distribution for the
connector. The thermal solution for this problem requires a knowledge of heat generation
distribution due to the self-heating of the connector as electrical current flows through it. Check out the video of Creating Connector in ElectroFlo.
A 3D Thermal Computational Fluid Dynamics (CFD) Model of the Controller Constructed to Solve for Temperature,
Velocity and Pressure Fields. The PCB was modeled as an Orthotropic solid with much
higher thermal conductivity in the XY plane.
Modes of Heat Transfer:
Convection (Computational Fluid Dynamics (CFD))
Component Heat Dissipation
Exponential Function of Junction
Analysis Type: Coupled Electrical / Thermal
Applications: Thermal Analysis of PCB and PWB's, Multi-layer Boards...
A 3D model was created to predict the temperature distribution for a flex board.
The traces are made of copper placed on polyester backing that electrically and
thermally isolate the individual circuits. The thermal solution of the circuits
requires the electrical heat generation distribution as boundary condition.
Trace Temperature Rise
Rack System with Cold Plates...
Analysis Type: Multi-System
Applications: Thermal Analysis of a Rack Cooling System
In this system, there are five electronics boxes mounted within a typical rack enclosure.
The heat dissipated in these boxes must be efficiently removed to maintain their functionality.
To accomplish this, the rack enclosure itself has vents along the back and on the top to allow the natural,
buoyancy driven, flow of ambient air through it. In addition, the three “shelves” on which the component boxes are mounted,
include internal flow passages through which cooling fluid is passed, i.e., cold plates. The cooling fluid circulating through
the plates is in a closed loop system which includes a heat exchanger and related fan mounted on the back of the rack enclosure
allowing the dissipation of the heat picked up by the fluid from the component boxes to the ambient air.
Small Components: 300 watts of dissipation
Large Component: 525 watts of dissipation
Total heat dissipation: 1725 watts
Vents located on the top and back for air flow
Relay Box Numerical Analysis...
Analysis Type: Coupled Electrical / Thermal / Computational Fluid Dynamics (CFD)
Applications: Thermal Analysis of Relay, Fuse and Junction Boxes...
A 3D model of the relay box was constructed to solve for temperature, velocity and
voltage fields and to predict the limiting component's temperature, indicate its
thermal margins and determine if additional cooling is required.
Radiation on Natural Convection to Ambient at 85°C
Heat Dissipation due to:
Self-Heating of Connectors and Traces
Analysis Type: Multi-System Applications: Thermal Analysis of Two Sets of Electronics ...
A sealed electronics box is tested with a tray/heat-exchanger.
Computational Fluid Dynamics (CFD)
15 Watts per board
Non-Computational Fluid Dynamics (CFD)
Temperature in at 30°C
Heat Exchanger modeled using a coupled flow network